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9 204 (0,071s) •

Project

WelConTex - Reliable ultrasonic welded electrical interconnection technology for smart textiles (EG16_079_0007465)

WelConTex - Reliable ultrasonic welded electrical interconnection technology for smart textiles...

JR - Ostatní strojírenství

  • 2017 - 2020
    • •
  • 14 780 tis. Kč
    • •
  • 3 925 tis. Kč
    • •
  • MPO
Project

D-CIRC - interconnection of CIRC technologies with stationary and deployable unclassified and certified KIS ... (OWVTUP2016003)

The aim of this project is to design a model solution describing how to realize the interconnection of monitoring, analytics and evaluation CIRC technologies to unclassified and classified communication and information systems.......

IN - Informatika

  • 2016 - 2017
    • •
  • 1 993 tis. Kč
    • •
  • 1 993 tis. Kč
    • •
  • MO
Project

*MERIT - Measurement environment for the reliability study of interconnection technologies. (FT-TA3/013)

*In this project a test system to be used in investigation and research on reliability of interconnections in integrated circuits and printed circuit boards will be developed and realised. Especially the reliability of interconnections

JA - Elektronika a optoelektronika, elektrotechnika

  • 2006 - 2009
    • •
  • 11 119 tis. Kč
    • •
  • 5 307 tis. Kč
    • •
  • MPO
Project

Multichannel interconnection of photonic chips for high-speed optical networks 5G + (FW07010035)

-optical interconnection of photonic chips for 5G+ networks with a total data rate exceeding 400 Gbit/s. Multichannel interconnection of photonic chips is currently interconnection of photonic chips, including protocol veri...

Electrical and electronic engineering

  • 2023 - 2025
    • •
  • 24 170 tis. Kč
    • •
  • 14 705 tis. Kč
    • •
  • TA ČR
Project

Advanced technologies of thermomechanically resistant component interconnection for power applications (TQ15000029)

The project objective is the R&D of technologies for contacting power components on ceramic substrates with additive realized conductive patterns. It aims to increase joint thermomechanical resistance as an alternative to soldering. The proj...

Electrical and electronic engineering

  • 2025 - 2026
    • •
  • 5 920 tis. Kč
    • •
  • 4 680 tis. Kč
    • •
  • TA ČR
Project

MENDELU RESEARCH INFRASTRUCTURE (ED4.1.00/11.0261)

-quality interconnection between research and development activities mainly at Faculty of Forestry and Wood Technology, MENDELU University ? state-of-the-art laboratories-quality conditions for top-class science in the field of fore...

DN - Vliv životního prostředí na zdraví

  • 2014 - 2015
    • •
  • 51 278 tis. Kč
    • •
  • 7 691 tis. Kč
    • •
  • MŠMT
Project

Integrated architecture of payment systém in transport (1F81C/048/190)

all systems use the same technologies and their function is very similar, such local card systems are isolated and mutually not interconnected. Demands resulting various identification acts leads to the requirement to interconn...

BC - Teorie a systémy řízení

  • 2008 - 2009
    • •
  • 3 800 tis. Kč
    • •
  • 3 800 tis. Kč
    • •
  • MD
Project

NoMaTex - New materials, technologies and textile electronic components for smart textiles (FV30051)

The aim of the project is the RaD of new materials, technologies and textile technologies will be also used. Choosing the right fabric composition and fabric structure not have the technology or knowledge for independent de...

Textiles; including synthetic dyes, colours, fibres (nanoscale materials to be 2.10; biomaterials to be 2.9)

  • 2018 - 2021
    • •
  • 24 360 tis. Kč
    • •
  • 16 945 tis. Kč
    • •
  • MPO
Project

Algorithms and interconnection networks for parallel systems (GA102/97/1055)

The aim of the project is to investigate the use of low-diameter shuffle-based (SB) topologies for interconnecting processors in high-performance scalable ) Research onstructural properties of SB topologies for constructing interconnecti...

JC - Počítačový hardware a software

  • 1997 - 1999
    • •
  • 1 525 tis. Kč
    • •
  • 950 tis. Kč
    • •
  • GA ČR
Project

Microstructure evolution of electroplated copper thin films for on-chip interconnections near room temperature (GP101/03/P165)

Microstructure evolution of electroplated copper thin films for on-chip interconnections near room temperature. Copper electroplating for on-chip metallization is central to Cu chip interconnection technology since copper r...

JG - Hutnictví, kovové materiály

  • 2003 - 2005
    • •
  • 650 tis. Kč
    • •
  • 650 tis. Kč
    • •
  • GA ČR
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