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29 (0,142s) •

Project

Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability (GA102/09/1701)

of lead-free soldering application with a view to reflow soldering process.The aim is optimizing of solder process parameters,definition of process windows and solders pads reflow process with fo...

JA - Elektronika a optoelektronika, elektrotechnika

  • 2009 - 2010
    • •
  • 725 tis. Kč
    • •
  • 565 tis. Kč
    • •
  • GA ČR
Project

Use of Modern Assembly Techniques and Materials in Electronic Industry (FR-TI1/072)

The aim of project i a research of assembly techniques on the field opplication of 3D techniques, ecological lead free soldering and using of LTCC ceramic materials will be solved methodology of "green" lead free soldering with opti...

JA - Elektronika a optoelektronika, elektrotechnika

  • 2009 - 2011
    • •
  • 609 tis. Kč
    • •
  • 416 tis. Kč
    • •
  • MPO
Project

Research and development Pb free solder. (FF-P2/046)

in the replacement of lead containing solders by solders with minimum guaranteed lead content. The newly developed solders with low lead content will fulfil the reguirements of European standards. Besides the achievement o...

JG - Hutnictví, kovové materiály

  • 2003 - 2004
    • •
  • 5 357 tis. Kč
    • •
  • 2 250 tis. Kč
    • •
  • MPO
Project

Development of new innovative cleaning device for cleaning printed circuit boards (PCB) (EG20_321/0023898)

of soldering machines. The aim of the project will be based on newly acquired knowledge products and soldering machine parts (soldering pallets) wave, selective soldering, segmented PCBs and soldering fur...

Electrical and electronic engineering

  • 2020 - 2023
    • •
  • 9 528 tis. Kč
    • •
  • 0 tis. Kč
    • •
  • MPO
Project

Dignostics and Optimization of the use of environmental materials for conductive joining in electronics (MEB0808109)

of joining materials - to lead-free solders and to electrically conductive adhesives of lead-free solder and conductive adhesive , influence of method of soldering and possible thermal processing after soldering o...

JA - Elektronika a optoelektronika, elektrotechnika

  • 2008 - 2009
    • •
  • 63 tis. Kč
    • •
  • 63 tis. Kč
    • •
  • MŠMT
Project

Phase equilibria in Zn-Sn-X metallic systems for high-temperature lead-free solders (OC08053)

are possible candidate materials for the high temperature lead-free soldering, mainly from physical and mechanical properties of prospective high-temperature solders. The study will cover materials convenient for soldering...

BJ - Termodynamika

  • 2008 - 2011
    • •
  • 1 735 tis. Kč
    • •
  • 1 735 tis. Kč
    • •
  • MŠMT
Project

Thermodynamic and Phase Diagram Studies of Systems for High Temperature Lead-Free Solders (OC09010)

The aim of our effort is to contribute to a database of knowledge on possible lead-free solder materials and soldering processes with respect to thermodynamic and mechanical properties of prospective high-temperature solders

JG - Hutnictví, kovové materiály

  • 2009 - 2011
    • •
  • 1 200 tis. Kč
    • •
  • 1 200 tis. Kč
    • •
  • MŠMT
Project

Theoretical modelling and experimental study of phase diagrams in seleted systems for lead free soldering (OC 531.002)

The aim of the project is the assessment of thermodynamic database for metals with low melting temperature, which will allow modelling of their phase diagrams. On the basis of these calculations, the proper materials for the substitution of lead-cont...

BJ - Termodynamika

  • 2002 - 2007
    • •
  • 3 240 tis. Kč
    • •
  • 1 675 tis. Kč
    • •
  • MŠMT
Project

Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications (OC08032)

Theoretical and experimental study of phase equilibria, physical, chemical, mechanical and utility properties of perspective solder materials for high-temperature applications. Our attention will be focused on Bi-Ag, Sb-Sn, Zn-Sn, Zn-Al bina...

JG - Hutnictví, kovové materiály

  • 2008 - 2011
    • •
  • 2 450 tis. Kč
    • •
  • 1 750 tis. Kč
    • •
  • MŠMT
Project

Theoretical and experimental study of phase diagrams of low-fusion binary and ternary alloys, their preparation and characterisation (OC 094)

increase basic knowledge on possible alloy systems that can be used as lead-free solder materials...

JG - Hutnictví, kovové materiály

  • 2006 - 2007
    • •
  • 800 tis. Kč
    • •
  • 400 tis. Kč
    • •
  • MŠMT
  • 1 - 10 out of 29