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804 (0,076s) •

Project

Research and development of digital technologies for advanced semiconductor processes (FW01010089)

Development of Analytical Platform and methodology that will enable the implementation of AI algorithms in an integrated semiconductor manufacturing environment for efficient yield analysis and resolution of complex issues, namely: - R&D of ...

Electrical and electronic engineering

  • 2020 - 2022
    • •
  • 29 590 tis. Kč
    • •
  • 17 328 tis. Kč
    • •
  • TA ČR
Project

Laser grinding of silicon carbide for high-power semiconductor applications - LaPSiC (TQ16000033)

process costs with promising potential for yield improvement, especially due to reducing wafer warpage. This goal requires collaboration among all the parties due of building the systems for SiC wafering. HiLASE has specif...

Materials engineering

  • 2025 - 2027
    • •
  • 26 167 tis. Kč
    • •
  • 18 773 tis. Kč
    • •
  • TA ČR
Project

*Research and development of advanced silicon wafer for sub-micron technologies. (FI-IM2/131)

*The development of advanced silicon wafer technology for production of high-tech integrated circuits with sub-micron detail. In order to reach these goals, we are going to install a new hot zone with diameter 450 mm for Czochralski pulling ...

JA - Elektronika a optoelektronika, elektrotechnika

  • 2005 - 2007
    • •
  • 11 668 tis. Kč
    • •
  • 3 345 tis. Kč
    • •
  • MPO
Project

Material and X-Ray Optical Properties of Formed Silicon Monocrystals (IAAX01220701)

wafers) after their exposure to thermal and mechanical stresses leading or unexploited possibilities of forming of Si wafers into precise optical surfaces and structures. Theoretical study using computer modeling will precede the S...

JJ - Ostatní materiály

  • 2007 - 2011
    • •
  • 5 607 tis. Kč
    • •
  • 5 607 tis. Kč
    • •
  • AV ČR
Project

SOI Structures for Advanced Semiconductor Applications (TA01010078)

1) Applied research of advanced semiconductor materials and structures and experimental development of technologies for their manufacturing, especially advanced technology of Silicon-On-Insulator (SOI) manufacturing and bonding of silicon wafers<...

JJ - Ostatní materiály

  • 2011 - 2013
    • •
  • 40 675 tis. Kč
    • •
  • 20 912 tis. Kč
    • •
  • TA ČR
Project

Research and Development of Technologies of Manufacturing of Novel Species of Silicon Wafers (FR-TI3/031)

Project is focused on R&D of novel processes of crystal growth, silicon wafers manufacturing and epitaxial layers growth. There are subjects of R&D of crystal growth (110) silicon ingots and large scale ingots (with diameter above 200 mm). C...

JJ - Ostatní materiály

  • 2011 - 2012
    • •
  • 11 503 tis. Kč
    • •
  • 3 870 tis. Kč
    • •
  • MPO
Project

Proposal of the Process of Single Side Etching of Silicon Wafer for the Application into the Process of Photovoltaic Solar Cells Production (FR-TI1/599)

The result of introduction of the one side etching into the process of solar cells production is increasing of the cell efficiency and decreasing of production cost.......

JA - Elektronika a optoelektronika, elektrotechnika

  • 2009 - 2013
    • •
  • 9 500 tis. Kč
    • •
  • 3 800 tis. Kč
    • •
  • MPO
Project

R&D of Silicon Carbide Semiconductor Structures (FW06010030)

R&D of technology for the production of polished and epitaxial silicon carbide wafers with a diameter of 200 mm for semiconductor applications. R&D of technology for the production of semiconductor devices based on silicon carbide for power ...

Materials engineering

  • 2023 - 2025
    • •
  • 33 230 tis. Kč
    • •
  • 19 970 tis. Kč
    • •
  • TA ČR
Project

*Advanced automated nano structuring using electron and ion beams (FR-TI2/756)

of wafers. Design of all these objectives will be verified by construction...

BF - Elementární částice a fyzika vysokých energií

  • 2010 - 2012
    • •
  • 20 384 tis. Kč
    • •
  • 11 085 tis. Kč
    • •
  • MPO
Project

On-wafer microwave metrology for future industrial applications (9B24017)

Polovodičové čipy se používají v mnoha zavedených i nově vznikajících aplikacích, např. v telekomunikacích 6G, radarových senzorech pro automobily, radiometrech pro monitorování Země umístěných ve vesmíru a nositelné elektronice pro zdravotnictví. V ...

Electrical and electronic engineering

  • 2024 - 2027
    • •
  • 4 893 tis. Kč
    • •
  • 2 447 tis. Kč
    • •
  • MŠMT
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