Residual Strain in PCBs with Cu-Plated Holes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F17%3A10366665" target="_blank" >RIV/00216208:11320/17:10366665 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/17:00315429
Result on the web
<a href="http://dx.doi.org/10.1007/s11664-017-5714-3" target="_blank" >http://dx.doi.org/10.1007/s11664-017-5714-3</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1007/s11664-017-5714-3" target="_blank" >10.1007/s11664-017-5714-3</a>
Alternative languages
Result language
angličtina
Original language name
Residual Strain in PCBs with Cu-Plated Holes
Original language description
The residual strain in pure printed circuit boards (PCBs) and PCBs with Cu-plated holes has been obtained by measurement of the temperature dependence of their dilatational characteristics in the x, y, and z directions up to 240A degrees C. Shrinkage in all directions was observed for all samples of both materials in the first thermal cycle. No permanent length changes were observed in the second or subsequent thermal cycles. The residual strain was determined from the difference in relative elongation between the first and second thermal cycles. Relaxation of residual strain occurred only in the first thermal cycle, as a thermally activated process. The highest value of relaxed residual strain was found in the z direction for both materials. Relaxation of residual strain in the z direction of the pure PCB occurred only in the negative strain range, whereas relaxation of the PCB with Cu-plated holes occurred in both the positive and negative strain ranges. The relaxation of the positive strain in the PCB with Cu-plated holes in the z direction implies that this part of the PCB was under pressure during its preparation. This relaxation is a consequence of the high coefficient of thermal expansion of PCB laminate in this direction, which can also lead to cracks in Cu holes when the material is heated above the glass-transition temperature.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
10302 - Condensed matter physics (including formerly solid state physics, supercond.)
Result continuities
Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Journal of Electronic Materials
ISSN
0361-5235
e-ISSN
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Volume of the periodical
46
Issue of the periodical within the volume
12
Country of publishing house
US - UNITED STATES
Number of pages
8
Pages from-to
6984-6991
UT code for WoS article
000414363200030
EID of the result in the Scopus database
2-s2.0-85026895508