Elimination of self excited oscillations via changes in the thickness of chips.
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F09%3APU82834" target="_blank" >RIV/00216305:26210/09:PU82834 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Elimination of self excited oscillations via changes in the thickness of chips.
Original language description
This paper deals with the possibility of elimination of self-excited oscillations by changing the thickness of chips. These oscillations occur between the tool and machining area during the cutting process without any outer influence. This results into degradation of the machined surface, the geometric accuracy and the noise. A model of cutting process (Eq 1,2) is constructed using the theory of regenerative principle. The model is used to derive analytical formulas for gains of two simple controllers (Fig 2) which control a piezoelectric compensator of the cutting force. The compensator changes the position of cutting tool against the machined surface. This changes the thickness of chips.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JR - Other machinery industry
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
The 5th International Conference Mechatronic Systems and Materials MSM- 2009
ISBN
978-9955-28-493-2
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
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Publisher name
Vilnius Gediminas Technical University
Place of publication
Vilnius
Event location
Vilnius
Event date
Oct 22, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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