Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F11%3APU87375" target="_blank" >RIV/00216305:26210/11:PU87375 - isvavai.cz</a>
Alternative codes found
RIV/68081723:_____/11:00368128
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
Original language description
Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JL - Fatigue and fracture mechanics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
STRAIN
ISSN
0039-2103
e-ISSN
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Volume of the periodical
47
Issue of the periodical within the volume
6
Country of publishing house
GB - UNITED KINGDOM
Number of pages
7
Pages from-to
476-482
UT code for WoS article
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EID of the result in the Scopus database
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