Influence of gigacycle fatigue on development of surface relief in UFG copper

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F11%3APU96263" target="_blank" >RIV/00216305:26210/11:PU96263 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Influence of gigacycle fatigue on development of surface relief in UFG copper
Original language description
The paper deals with localization of cyclic plasticity in ultrafine-grained copper in gigacycle fatigue regime. The studied copper was prepared by equal channel angular pressing. The cyclic loading was conducted at 20 kHz frequency. It has been found that the cyclic slip bands do not appear well below the fatigue limit, contrary to the conventionally grained copper. Cyclic slip bands develop in "near-by oriented regions". The length of the cyclic slip bands in these regions exceeds substantially the average grain size. The density of cyclic slip bands in specimens, which failed at 10^10 cycles, is very low. Observation of surface relief and microstructure of cyclic slip bands by means focused ion beam technique in scanning electron microscope revealedthe development of damage below the surface extrusions which finally results in fatigue crack initiation.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
TRANSCOM 2011, 9-th EUROPEAN CONFERENCE OF YOUNG RESEARCH AND SCIENTIFIC WORKERS
ISBN
978-80-554-0374-8
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
129-132
Publisher name
EDIS - Žilina University publisher
Place of publication
Žilina
Event location
Žilina
Event date
Jun 27, 2011
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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