Analytical and Numerical Analysis of Thermal Structure
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F22%3APU145395" target="_blank" >RIV/00216305:26210/22:PU145395 - isvavai.cz</a>
Result on the web
<a href="https://www.engmech.cz/improc/2022/061.pdf" target="_blank" >https://www.engmech.cz/improc/2022/061.pdf</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Analytical and Numerical Analysis of Thermal Structure
Original language description
Heat conductive structures were designed for the Miniaturized Heat Switch to improve its parameters which are not satisfying in the prior solution. The thermal conductivity is lower than 1.5 W·K-1 and weight is higher than 55.1 g. To design a new efficient heat conductive structure, it was necessary to make their analytical models to compute thermal conductivity and weight. The parameters computed analytically were verified by numerical analysis which confirmed the accuracy of the calculation. The thermal conductivity of new structures is significantly higher with the most promising concept of 2T-shape structure.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
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OECD FORD branch
20304 - Aerospace engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů