Influence of the CTE on Mechanical Stress of Chip SMD Components

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU29275" target="_blank" >RIV/00216305:26220/02:PU29275 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Influence of the CTE on Mechanical Stress of Chip SMD Components

Original language description

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2002

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Socrates Workshop 2002 - Proceedings

ISBN

80-214-2217-3

ISSN

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e-ISSN

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Number of pages

5

Pages from-to

92-96

Publisher name

Neuveden

Place of publication

Brno

Event location

Chania, Crete

Event date

Sep 2, 2002

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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