Cheep Solution for MSM (MMS)
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU38968" target="_blank" >RIV/00216305:26220/03:PU38968 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Cheep Solution for MSM (MMS)
Original language description
Multisubstrate modeles are new solution in 3D package construction. There are some new principles described in this paper
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
14th European Microelectronics and Packaging Conference
ISBN
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ISSN
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e-ISSN
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Number of pages
5
Pages from-to
436-440
Publisher name
IMAPS Germany
Place of publication
Friedrichshafen, BRD
Event location
Friedrichshafen
Event date
Jun 23, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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