Soldering and lead free solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45795" target="_blank" >RIV/00216305:26220/04:PU45795 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Soldering and lead free solders
Original language description
This article deals with lead free solders and technological process
Czech name
Pájení a bezolovnaté pájky
Czech description
Článek pojednává o problematice bezolovnatých pájek a pájecího procesu
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F04%2F0590" target="_blank" >GA102/04/0590: Development of microelectronics technologies for 3D circuits and systems</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Sdělovací technika
ISSN
0036-9942
e-ISSN
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Volume of the periodical
2004
Issue of the periodical within the volume
6
Country of publishing house
CZ - CZECH REPUBLIC
Number of pages
4
Pages from-to
3-6
UT code for WoS article
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EID of the result in the Scopus database
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