Phase Change Materials for Thermal Management of IC Packages

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F07%3APU69212" target="_blank" >RIV/00216305:26220/07:PU69212 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Phase Change Materials for Thermal Management of IC Packages
Original language description
This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.
Czech name
Materiály s fázovou změnou v teplotním managementu pouzder IO
Czech description
This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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