Characterization of Laser Drilled Via Interconnections in LTCC Substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F08%3APU74272" target="_blank" >RIV/00216305:26220/08:PU74272 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Characterization of Laser Drilled Via Interconnections in LTCC Substrates
Original language description
This paper deals with analyses of laser-machined vias in LTCC (Low Temperature Cofired Ceramics)-substrates with regard to geometrical performance of holes and electrical characteristics of metalized vias.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ISSE 2008 Abstract Proceedings
ISBN
978-963-06-4915-5
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
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Publisher name
Mesterprint Printinghouse Ltd.
Place of publication
Budapest, Hungary
Event location
Budapest
Event date
May 7, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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