Numerical solution of phase change materials for thermal management of integrated circuit packages

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F08%3APU76136" target="_blank" >RIV/00216305:26220/08:PU76136 - isvavai.cz</a>

Result on the web

—

DOI - Digital Object Identifier

—

Result language

angličtina

Original language name

Numerical solution of phase change materials for thermal management of integrated circuit packages

Original language description

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

Czech name

Numerical solution of phase change materials for thermal management of integrated circuit packages

Czech description

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

—

Project

—

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2008

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Acta Technica ČSAV

ISSN

0001-7043

e-ISSN

—

Volume of the periodical

53

Issue of the periodical within the volume

1

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

14

Pages from-to

—

UT code for WoS article

—

EID of the result in the Scopus database

—