New trends of BGA Soldering in education

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU83867" target="_blank" >RIV/00216305:26220/09:PU83867 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
New trends of BGA Soldering in education
Original language description
This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Project
<a href="/en/project/2E08051" target="_blank" >2E08051: Research of methods and techniques for general public familiarization with a researcher work by information technologies</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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