New Connection of Electronic Modules
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F09%3APU85003" target="_blank" >RIV/00216305:26220/09:PU85003 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
čeština
Original language name
New Connection of Electronic Modules
Original language description
This article describes a new method of connecting electronic and microelectronic modules to a printed board. Classic chip or cylindrical SMD components are used to connect. The connection is formed with "green" LF solder SAC 305. We examined the possibility of use of assembly machines with optical control insertion.
Czech name
New Connection of Electronic Modules
Czech description
This article describes a new method of connecting electronic and microelectronic modules to a printed board. Classic chip or cylindrical SMD components are used to connect. The connection is formed with "green" LF solder SAC 305. We examined the possibility of use of assembly machines with optical control insertion.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
<a href="/en/project/FR-TI1%2F072" target="_blank" >FR-TI1/072: Use of Modern Assembly Techniques and Materials in Electronic Industry</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems EDS09, Imaps International Conference 2009
ISBN
978-80-214-3933-7
ISSN
—
e-ISSN
—
Number of pages
3
Pages from-to
—
Publisher name
Novpress s.r.o. Brno
Place of publication
Brno
Event location
Brno
Event date
Sep 2, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—