DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU86626" target="_blank" >RIV/00216305:26220/10:PU86626 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES
Original language description
This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.
Czech name
DEVELOPMENT OF LEAD-FREE SOLDERED 3D STRUCTURES
Czech description
This paper describes design, construction and some test results of lead-free soldered three-dimensional structures based on combination of stacked thick-film Al2O3 or LTCC and FR-4 substrates.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
STUDENT EEICT 2010
ISBN
978-80-214-4079-1
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
NOVPRESS
Place of publication
Brno
Event location
FEKT VUT v Brně
Event date
Apr 29, 2010
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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