On the Application of Solder Balls for 3D Packaging
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU88231" target="_blank" >RIV/00216305:26220/10:PU88231 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
On the Application of Solder Balls for 3D Packaging
Original language description
Deals with the Application of Solder Balls for 3D Packaging and modern electronic system configurations
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GA102%2F09%2F1701" target="_blank" >GA102/09/1701: Research and Development of the New Soldering Principles for Increasing of Solder Joints Reliability</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
PLUS
ISSN
1436-7505
e-ISSN
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Volume of the periodical
2010
Issue of the periodical within the volume
8
Country of publishing house
DE - GERMANY
Number of pages
6
Pages from-to
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UT code for WoS article
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EID of the result in the Scopus database
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