Thick Film 3-D Electrode Configuration for Electrochemical Applications

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU101025" target="_blank" >RIV/00216305:26220/12:PU101025 - isvavai.cz</a>
Result on the web
<a href="http://www.estc2012.eu" target="_blank" >http://www.estc2012.eu</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Thick Film 3-D Electrode Configuration for Electrochemical Applications
Original language description
Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method ? ball and wire bonding is discussed in this paper.
Czech name
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Czech description
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Project
<a href="/en/project/2A-1TP1%2F143" target="_blank" >2A-1TP1/143: Research of novel mechatronic MEMS structures for pressure measurements</a><br>
Continuities
S - Specificky vyzkum na vysokych skolach

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012
ISBN
978-1-4673-4644-3
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
1-6
Publisher name
Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium
Place of publication
Amsterdam
Event location
Amsterdam RAI
Event date
Sep 17, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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