Connection of Electronic and Microelectronic Modules
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU106739" target="_blank" >RIV/00216305:26220/13:PU106739 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Connection of Electronic and Microelectronic Modules
Original language description
Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components)
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland
ISBN
978-83-932464-1-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IMAPS Poland Chapter
Place of publication
Krakow
Event location
Krakow
Event date
Sep 22, 2013
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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