The Use of Computer Simulation in the Electronic Packaging Process
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F13%3APU106919" target="_blank" >RIV/00216305:26220/13:PU106919 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.4028/www.scientific.net/KEM.592-593.201" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/KEM.592-593.201</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.4028/www.scientific.net/KEM.592-593.201" target="_blank" >10.4028/www.scientific.net/KEM.592-593.201</a>
Alternative languages
Result language
čeština
Original language name
The Use of Computer Simulation in the Electronic Packaging Process
Original language description
This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creationof a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.
Czech name
The Use of Computer Simulation in the Electronic Packaging Process
Czech description
This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creationof a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Key Engineering Materials (print)
ISSN
1013-9826
e-ISSN
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Volume of the periodical
2014
Issue of the periodical within the volume
592-593
Country of publishing house
CH - SWITZERLAND
Number of pages
4
Pages from-to
201-204
UT code for WoS article
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EID of the result in the Scopus database
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