REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F14%3APU110784" target="_blank" >RIV/00216305:26220/14:PU110784 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD
Original language description
The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.
Czech name
REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD
Czech description
The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LO1210" target="_blank" >LO1210: Energy for Sustainable Development</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014
ISBN
978-80-905525-1-7
ISSN
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e-ISSN
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Number of pages
172
Pages from-to
114-118
Publisher name
Neuveden
Place of publication
Jasná, Slovak Republic
Event location
Jasná
Event date
Jun 25, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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