Workshop Wirebonding

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3AEV23793" target="_blank" >RIV/00216305:26220/15:EV23793 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Workshop Wirebonding

Original language description

Training of new methods in the field of contacting of semiconductor chips and sensors. Practical examples and work on a semiautomatic TPT machine. The workshop also a demonstrate of pick and place equipment, and measurement and testing wire bonds strength.

Czech name

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Czech description

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Type

W - Workshop organization

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2015

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Event location

Technická 8, Brno

Event country

CZ - CZECH REPUBLIC

Event starting date

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Event ending date

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Total number of attendees

20

Foreign attendee count

3

Type of event by attendee nationality

EUR - Evropská akce