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The Vibration Testing as Tool for Optimizing of Two PCB Connection

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU115494" target="_blank" >RIV/00216305:26220/15:PU115494 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/abstract/document/7248018" target="_blank" >https://ieeexplore.ieee.org/abstract/document/7248018</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2015.7248018" target="_blank" >10.1109/ISSE.2015.7248018</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    The Vibration Testing as Tool for Optimizing of Two PCB Connection

  • Original language description

    This article deals with the use of mechanical testing to optimize the configuration of PCB. Specifically, the system of two connected boards is being investigated under the vibration load. Vibration measurement of such system is compared with the computer simulation and results from both methods are then evaluated including defining the main parameters. This research is related to the European project Board on Board (BOB), which focuses on new technology of two board interconnection, which is dedicated for high density assembly and interconnection.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/LF15007" target="_blank" >LF15007: Board on Board - BoB II</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology

  • ISBN

    978-963-313-177-0

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    339-342

  • Publisher name

    Neuveden

  • Place of publication

    Neuveden

  • Event location

    Eger

  • Event date

    May 6, 2015

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000374113000069