Optimization of Through-hole Plating Method for Prototyping
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU117255" target="_blank" >RIV/00216305:26220/15:PU117255 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Optimization of Through-hole Plating Method for Prototyping
Original language description
Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter
ISBN
978-80-214-5270-1
ISSN
1802-4564
e-ISSN
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Number of pages
3
Pages from-to
54-56
Publisher name
Neuveden
Place of publication
Neuveden
Event location
Brno
Event date
Oct 15, 2015
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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