The Analysis of Solder Preforms in Surface Mount Assembly

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU119081" target="_blank" >RIV/00216305:26220/16:PU119081 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
The Analysis of Solder Preforms in Surface Mount Assembly
Original language description
This article is focused on the sphere of solder joints reliability in technology of surface mount assembly and the issue of manufactory of solder joints with solder preforms is introduced closer. It also describes types of solder preforms, their applicaton and different methods of using in surface mount assembly. Text further comprises comparison of the solder joint which is manufactured by printing of solder paste through the cooper stencil and solder joint manufactured by applying of solder preform. The results of these basic processes are compared with method of solder fortification. In conclusion, there are evaluated outputs from experimental manufactory of solder joints with solder preforms and complemented by outputs which are achieved by x-ray machine.
Czech name
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Czech description
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Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 22nd Conference STUDENT EEICT 2016
ISBN
978-80-214-5350-0
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
685-689
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Neuveden
Event location
Brno
Event date
Apr 28, 2016
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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