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A chip based on microelectrode arrays for the fabrication of single nanowire system via dielectrophoresis effect

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU121283" target="_blank" >RIV/00216305:26220/16:PU121283 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    A chip based on microelectrode arrays for the fabrication of single nanowire system via dielectrophoresis effect

  • Original language description

    We develop a chip based on microelectrode arrays to be used in the fabrication of single nanowire (NW) systems for gas detection. The proposed topology of test electrode system was designed to understand the different factor involved in the dielectrophoresis (DEP) process and determine the optimal conditions for a facile integration and alignment of semiconducting metal oxide NWs produced via aerosol-assisted chemical vapor deposition (AACVD). Various electrode geometries with electrode gaps between 2 and 10 µm and electrode tip-end shapes are investigated. Results obtained from SEM, optical microscopy and electrical measurement demonstrate the integration and alignment of single NW across the electrodes only for the electrodes with gaps below 3 µm. These results are discussed and further improvements in the design of these systems are suggested.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JB - Sensors, detecting elements, measurement and regulation

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    IMAPS Flash Conference 2nd International Microelectronics Assembly and Packaging Society Flash Conference

  • ISBN

    978-80-214-5416-3

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    1-5

  • Publisher name

    IMAPS

  • Place of publication

    Brno

  • Event location

    Brno

  • Event date

    Nov 3, 2016

  • Type of event by nationality

    EUR - Evropská akce

  • UT code for WoS article