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Optical pressure sensors for harsh environment

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F18%3APU130207" target="_blank" >RIV/00216305:26220/18:PU130207 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/8346868" target="_blank" >https://ieeexplore.ieee.org/document/8346868</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.23919/EMPC.2017.8346868" target="_blank" >10.23919/EMPC.2017.8346868</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Optical pressure sensors for harsh environment

  • Original language description

    This paper deals with the design, manufacturing, and evaluation of a new optical pressure sensor produced by using Low Temperature Co-fired Ceramic technology. This optical sensor is designed for the applications with harsh operating conditions. The sensor has to withstand temperatures up to 300 °C and work in chemically aggressive environment. The paper gives a brief overview of the benefits and problems related to the optical measurement methods suitable for pressure sensor interrogation. Optical spectrum change based measurement method was chosen for the best sensor performance. Pressure transducer presented in this paper is based on the interrogation of the light spectra reflected from the Fabry-Pérot optical cavity. The sensors were designed for various pressure ranges, samples were manufactured, measured and tested. A selected optical method for enhancing the temperature compensation and measurement accuracy is discussed.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20504 - Ceramics

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2018

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European

  • ISBN

    978-0-9568086-4-6

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    1-5

  • Publisher name

    Neuveden

  • Place of publication

    Neuveden

  • Event location

    Warsaw, Polsko

  • Event date

    Sep 10, 2017

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article