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Usage of offset printing technology for printed electronics and smart labels

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU136488" target="_blank" >RIV/00216305:26220/20:PU136488 - isvavai.cz</a>

  • Result on the web

    <a href="https://tsp.vutbr.cz/datas/tsp2020/TSP2020.pdf" target="_blank" >https://tsp.vutbr.cz/datas/tsp2020/TSP2020.pdf</a>

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Usage of offset printing technology for printed electronics and smart labels

  • Original language description

    Printed electronics is key segment in modern fabrication of ultra-low-cost RFID/NFC/RF tags, smart labels, packaging, sensors etc. This paper shows the opportunity of usage of well known printing process called "offset printing" or "offset lithography". It is widely spread and well developed industry, but rarely used for printed electronics and smart tags. This work proposes usage of offset press on variety of substrates at high speed and large capacity production of printed electronics and also points to a connection of a lot of post-press technologies such as foil lamination, cutting, die-cutting, embossing, gluing etc. This additive technology provides an open door for smart packaging manufacturing, simply the RFID antenna can be printed by offset press directly on the substrate (usually paper) that is forming the box, smart label or sticker. Variety of substrates is also well maintained, offset press is usually equipped with UV, IR or hot air drying units, that enables printing on flexible substrates. More printing units also provides the technological possibility of layers overprinting.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    43rd International Conference on Telecommunications and Signal Processing

  • ISBN

    978-1-7281-6376-5

  • ISSN

  • e-ISSN

  • Number of pages

    3

  • Pages from-to

    657-659

  • Publisher name

    Neuveden

  • Place of publication

    Neuveden

  • Event location

    Milan, Italy

  • Event date

    Jul 7, 2020

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article