Electromigration and Flux Residues.

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141919" target="_blank" >RIV/00216305:26220/21:PU141919 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Electromigration and Flux Residues.
Original language description
Assembly and interconnection structures and assemblies are characterized by a larger proportion of HDI structures (line/space < 100 m), higher component density, a wide range of materials used and with a frequent absence of cleaning procedures after mass soldering and nonhermetic packages. On the electro-insulating surfaces, both atoms and molecules of flux residues and molecules of the polar liquid forming the electrolyte (most often water) are adsorbed. The interaction of metal materials with the polar environment and the ensuing electrical voltage is associated with chemical reactions and subsequent surface and volume diffusion. The acceleration of these electrochemical reactions is helped by higher working temperatures, higher humidity, size and frequency of electrical voltage between conductors. The result is often so-called electromigration, which is associated with the reduction of surface insulation resistance, corrosion, dendrite/fiber growth and the formation of subsequent short circuits.
Czech name
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Czech description
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Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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