2023 46th International Conference on Telecommunications and Signal Processing (TSP)

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F23%3AEV28061" target="_blank" >RIV/00216305:26220/23:EV28061 - isvavai.cz</a>
Result on the web
<a href="https://tsp.vutbr.cz/" target="_blank" >https://tsp.vutbr.cz/</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
2023 46th International Conference on Telecommunications and Signal Processing (TSP)
Original language description
In cooperation with the IEEE Region 8 (Europe, Middle East and Africa), IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society, the TSP 2023, driven by the theme ‘AI for Bright Future of Humanity‘, is organized by eighteen universities from Czech Republic, Hungary, Turkey, Croatia, Taiwan, Japan, Slovak Republic, Spain, Bulgaria, France, Romania, Slovenia, Greece, and Poland, for academics, researchers, and developers and it serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors.
Czech name
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Czech description
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Type
M - Conference organization
CEP classification
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OECD FORD branch
20200 - Electrical engineering, Electronic engineering, Information engineering

Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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