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Multiple Hankel matrix rank minimization for audio inpainting

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F23%3APU148587" target="_blank" >RIV/00216305:26220/23:PU148587 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/10197741" target="_blank" >https://ieeexplore.ieee.org/document/10197741</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/TSP59544.2023.10197741" target="_blank" >10.1109/TSP59544.2023.10197741</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Multiple Hankel matrix rank minimization for audio inpainting

  • Original language description

    Sasaki et al. (2018) presented an efficient audio declipping algorithm, based on the properties of Hankel-structure matrices constructed from time-domain signal blocks. We adapt their approach to solving the audio inpainting problem, where samples are missing in the signal. We analyze the algorithm and provide modifications, some of them leading to an improved performance. Overall, it turns out that the new algorithms perform reasonably well for speech signals but they are not competitive in the case of music signals.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20203 - Telecommunications

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2023

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the 2023 46th International Conference on Telecommunications and Signal Processing (TSP)

  • ISBN

    979-8-3503-0396-4

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    47-51

  • Publisher name

    IEEE

  • Place of publication

    Prague, Czech republic

  • Event location

    Prague

  • Event date

    Jul 12, 2023

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article