Experimental study of glass frit bonding

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F12%3APU98794" target="_blank" >RIV/00216305:26620/12:PU98794 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Experimental study of glass frit bonding
Original language description
Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressivebonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing,high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.
Czech name
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Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
S - Specificky vyzkum na vysokych skolach

Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
XII. Pracovní setkání fyzikálních chemiků a elektrochemiků
ISBN
978-80-7375-618-5
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
214-215
Publisher name
Mendelova univerzita v Brně
Place of publication
Brno
Event location
Brno
Event date
May 30, 2012
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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