Ceramic joints for pressure sensors development

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F13%3APU106104" target="_blank" >RIV/00216305:26620/13:PU106104 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1117/12.2014229" target="_blank" >http://dx.doi.org/10.1117/12.2014229</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1117/12.2014229" target="_blank" >10.1117/12.2014229</a>

Result language
angličtina
Original language name
Ceramic joints for pressure sensors development
Original language description
This article describes the research work related to the ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in electronics industry and motivation for joining ceramics is described in the introduction. Important directions for future research are summarized, with emphasis on the statistical determination of poor joint, and how the modification of a joint technology and process setting affects results and parameters that have been achieved. Main requirements for evaluating quality of joints are described in this paper together with the results of simulations of real ceramic joint application which is ceramic pressure sensor. During manufacturing process of this pressure sensor is one of the most critical part cooling process which was subjected to detail analysis due to number of failures and parasitic deformations revealed after removing assembled and joint pressure sensor from the
Czech name
—
Czech description
—

Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Similar results(10)