Cooling circuits optimisation of injection tools bymeans of temperature fields measuring

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F46747885%3A24210%2F03%3A24210055" target="_blank" >RIV/46747885:24210/03:24210055 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Cooling circuits optimisation of injection tools bymeans of temperature fields measuring
Original language description
Final injection moulding quality dependent on not only the filling process of the mould cavity but also the velocity and the cooling progress. The cooling process has already begun in time of the injection and followed within the holding pressure till the time of release. Progress of processing quantities differs from cool circuits position of the moulding and they are influenced upon its shape, thickness, injection pressure, volume velocity, stress and temperature fields, etc. Understanding to temperature fields enable to detect possible defects of the injection moulding. It means changes of their properties, structure and moulding?s dimension ? design of cooling circuits.
Czech name
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Czech description
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Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Mezinárodní konference ?Technomer 2003?, Chemnitz, SRN, listopad 2003
ISBN
3-00-01-2510-8
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
42-45
Publisher name
Technische Universität Chemnitz
Place of publication
Chemnitz, Německo
Event location
Chemnitz, Německo
Event date
Jan 1, 2003
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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