Implementation of Non-Destructive Evaluation and Process Monitoring in DLP-based Additive Manufacturing
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F46747885%3A24210%2F17%3A00004027" target="_blank" >RIV/46747885:24210/17:00004027 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1515/eng-2017-0016" target="_blank" >http://dx.doi.org/10.1515/eng-2017-0016</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1515/eng-2017-0016" target="_blank" >10.1515/eng-2017-0016</a>
Alternative languages
Result language
angličtina
Original language name
Implementation of Non-Destructive Evaluation and Process Monitoring in DLP-based Additive Manufacturing
Original language description
This article describes a method of in-situ process monitoring in the digital light processing (DLP) 3D printer. It is based on the continuous measurement of the adhesion force between printing surface and bottom of a liquid resin bath. This method is suitable only for the bottom-up DPL printers. Control system compares the force at the moment of unsticking of printed layer from the bottom of the tank, when it has the largest value in printing cycle, with theoretical value. Implementation of suggested algorithm can make detection of faults during the printing process possible.
Czech name
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Czech description
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Classification
Type
J<sub>SC</sub> - Article in a specialist periodical, which is included in the SCOPUS database
CEP classification
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OECD FORD branch
20301 - Mechanical engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Open Engineering
ISSN
2391-5439
e-ISSN
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Volume of the periodical
7
Issue of the periodical within the volume
1
Country of publishing house
PL - POLAND
Number of pages
6
Pages from-to
100-105
UT code for WoS article
000403109100005
EID of the result in the Scopus database
2-s2.0-85018960509