Strains in Electronic Assembly of Printed Circuit Boards

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F47718684%3A_____%2F24%3A10002325" target="_blank" >RIV/47718684:_____/24:10002325 - isvavai.cz</a>
Result on the web
<a href="https://online.obd.cz/id_publ/2327" target="_blank" >https://online.obd.cz/id_publ/2327</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Strains in Electronic Assembly of Printed Circuit Boards
Original language description
The purpose of the article is to show the reason and importance of PCB tests. The main objective of PCB tests is to determine the principal strains in the areas of high strain concentration especially at the corners of large circuit components. Board flexure control using strain gage measurement is the accepted method to verify that the assembly and test processes are not exceeding defined strain levels.
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Experimental stress analysis 2024, 62 International Conference
ISBN
979-8-3313-1105-6
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
43-44
Publisher name
Česká společnost pro mechaniku
Place of publication
Plzeň
Event location
Boží Dar, Czech Republic
Event date
Jun 4, 2024
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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