Verification of Thermal Treatment Influence on Thermosetting Epoxy Laminate Properties via Dynamic Mechanical Analysis
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A00503629" target="_blank" >RIV/49777513:23220/10:00503629 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Verification of Thermal Treatment Influence on Thermosetting Epoxy Laminate Properties via Dynamic Mechanical Analysis
Original language description
The application of dynamic mechanical analysis at verification of thermal treatment influence on thermosetting epoxy laminate properties was studied. Thermosetting epoxy laminates are essential parts of many engineering structures, and most often appearas the glass fibre-reinforced boards. The laminates are exposed to various conditions during operation, but mainly to thermal stress, which can have a decisive effect on their properties. As a result, characteristics that can sufficiently quantify this effect are needed. Monitoring of the glass transition temperature behavior and its dependence on level of thermal degradation is one of many options. Dynamic mechanical analysis (DMA) is considered one of the most exact techniques for glass transition temperature measurement. DMA is a technique in which the deformation of a sample under oscillatory load is measured as a function of temperature whilst the sample is subjected to a controlled temperature programme. Thermosetting epoxy lamina
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 2010 International Conference on Condition Monitoring and Diagnosis
ISBN
978-4-88686-070-5
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
The Institute of Electrical Engineers of Japan
Place of publication
Tokyo
Event location
Tokyo
Event date
Jan 1, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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