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Verification of Thermal Treatment Influence on Thermosetting Epoxy Laminate Properties via Dynamic Mechanical Analysis

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A00503629" target="_blank" >RIV/49777513:23220/10:00503629 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Verification of Thermal Treatment Influence on Thermosetting Epoxy Laminate Properties via Dynamic Mechanical Analysis

  • Original language description

    The application of dynamic mechanical analysis at verification of thermal treatment influence on thermosetting epoxy laminate properties was studied. Thermosetting epoxy laminates are essential parts of many engineering structures, and most often appearas the glass fibre-reinforced boards. The laminates are exposed to various conditions during operation, but mainly to thermal stress, which can have a decisive effect on their properties. As a result, characteristics that can sufficiently quantify this effect are needed. Monitoring of the glass transition temperature behavior and its dependence on level of thermal degradation is one of many options. Dynamic mechanical analysis (DMA) is considered one of the most exact techniques for glass transition temperature measurement. DMA is a technique in which the deformation of a sample under oscillatory load is measured as a function of temperature whilst the sample is subjected to a controlled temperature programme. Thermosetting epoxy lamina

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the 2010 International Conference on Condition Monitoring and Diagnosis

  • ISBN

    978-4-88686-070-5

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

  • Publisher name

    The Institute of Electrical Engineers of Japan

  • Place of publication

    Tokyo

  • Event location

    Tokyo

  • Event date

    Jan 1, 2010

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article