Technical Challenges of Screen Printing Deposition for Ultra-fine Patterns

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43897129" target="_blank" >RIV/49777513:23220/11:43897129 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Technical Challenges of Screen Printing Deposition for Ultra-fine Patterns

Original language description

This paper presents a research focused on advanced screen printing technique development. In the paper it is shown that it is possible to realize structures with line width below 50 mým at the pitch below 100 mým and ultra-thin film deposition well below1 mým by advanced screen printing technique. Screen printing quality and its resolution relate to many factors such as the type of mesh, emulsion, paste, the thickness of emulsion and squeegee speed and its hardness. These printing parameters and many others were analyzed in the presented research project.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

Result was created during the realization of more than one project. More information in the Projects tab.

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

ElectroScope

ISSN

1802-4564

e-ISSN

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Volume of the periodical

2011

Issue of the periodical within the volume

3

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

5

Pages from-to

1-5

UT code for WoS article

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EID of the result in the Scopus database

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