SU-8 microchannels for live cell dielectrophoresis improvements
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925715" target="_blank" >RIV/49777513:23220/15:43925715 - isvavai.cz</a>
Alternative codes found
RIV/49777513:23520/15:43925715
Result on the web
<a href="http://dx.doi.org/10.1109/DTIP.2015.7160971" target="_blank" >http://dx.doi.org/10.1109/DTIP.2015.7160971</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/DTIP.2015.7160971" target="_blank" >10.1109/DTIP.2015.7160971</a>
Alternative languages
Result language
angličtina
Original language name
SU-8 microchannels for live cell dielectrophoresis improvements
Original language description
In this work a novel SU-8 fabrication technology is employed to construct microfluidic devices for sensitive dielectrophoretic (DEP) manipulation of budding yeast cells. Identical devices were produced with standard soft-lithography processes. In comparison to standard PDMS based soft-lithography, an SU- 8 layer was used to construct the microchannel walls sealed by a flat sheet of PDMS to obtain the microfluidic channels. Direct bonding of PDMS to SU-8 surface was achieved by efficient wet chemical silanization combined with oxygen plasma treatment of the contact surface. The presented fabrication process significantly improved the alignment of the microstructures. In addition, PDMS delamination above electrode topologies was significantly decreased over standard soft-lithography devices. The fabrication time and costs of the proposed methodology were found to be roughly the same. Sensitivity of the devices was tested by discriminating Saccharomyces cerevisiae cells in the G1 phase from cells in the S/G2/M phase using dielectrophoresis. This level of sensitivity necessitated high precision electrode structure that was designed using an FEM model based approach. Attaining such high precision using standard soft-lithography can be difficult due to additional requirements of an alignment stage and its associated tight timing limits.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20205 - Automation and control systems
Result continuities
Project
<a href="/en/project/ED1.1.00%2F02.0090" target="_blank" >ED1.1.00/02.0090: NTIS - New Technologies for Information Society</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)
ISBN
978-1-4799-8625-5
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
42-45
Publisher name
IEEE
Place of publication
Montpellier
Event location
Montpellier, France
Event date
May 27, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000380516700010