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Influence of flexible substrate roughness with Aerosol Jet printed pads on the mechanical shear strength of glued joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43931844" target="_blank" >RIV/49777513:23220/17:43931844 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/document/8000911/" target="_blank" >http://ieeexplore.ieee.org/document/8000911/</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2017.8000911" target="_blank" >10.1109/ISSE.2017.8000911</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of flexible substrate roughness with Aerosol Jet printed pads on the mechanical shear strength of glued joints

  • Original language description

    This paper presents a research focused on Aerosol Jet printed pads adhesion improvement for electrically conductive adhesives (ECA) testing. The Aerosol Jet technology is able to use nanoparticle inks for deposition process. The adhesion of the ink to the substrate is crucial especially when you realize printing on flexible substrates. The paper will show a new method of adhesion improvement by plasma treatment and fine sandpaper grinding. The adhesion testing was realized by shear strength test of glued joints. Ten SMD chip resistors 1206 were mounted to the electrically conductive adhesive on aerosol jet printed pads for each sample. The advantages, disadvantages and full results of adhesion improvement method are discussed in the paper.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/LO1607" target="_blank" >LO1607: RICE - New technologies and concepts for smart industrial system</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2017

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2017)

  • ISBN

    978-1-5386-0582-0

  • ISSN

  • e-ISSN

    neuvedeno

  • Number of pages

    6

  • Pages from-to

    1-6

  • Publisher name

    IEEE

  • Place of publication

    Piscataway

  • Event location

    Sofia, Bulgaria

  • Event date

    May 10, 2017

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article