Temperature distribution optimization of multichannel sensor system for thermal testing of protective gloves

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F19%3A43955602" target="_blank" >RIV/49777513:23220/19:43955602 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8810285" target="_blank" >https://ieeexplore.ieee.org/document/8810285</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810285" target="_blank" >10.1109/ISSE.2019.8810285</a>

Result language
angličtina
Original language name
Temperature distribution optimization of multichannel sensor system for thermal testing of protective gloves
Original language description
This paper deals with temperature distribution optimization in flexible printed circuit boards (FPCBs) with assembled temperature sensors. They are a part of a testing system, which is intended to be used for testing of the thermal protection level of protective gloves. In total 28 individual FPCBs with totally 272 temperature sensors TMP-05 will be integrated into a grooves on the human hand model and attached in the grooves by UV-curable adhesive. The main goal is heat localization in the area of the temperature sensor and thus increasing reliability in identifying critical areas of the glove. The FPCBs with different types of ground pours were locally exposed to the radiant heat source and results of the measurements were compared to the temperature distribution simulations.
Czech name
—
Czech description
—

Project
<a href="/en/project/EG15_019%2F0004628" target="_blank" >EG15_019/0004628: A unique test system and advanced semi-automatic production technology to increase the comfort and protection gloves against thermal risks.</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE 2019) : /proceedings/
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Wroclaw, Poland
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000057

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