Interconnection of terminals on flexible substrates with printed conductive patterns

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958896" target="_blank" >RIV/49777513:23220/20:43958896 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9120956" target="_blank" >https://ieeexplore.ieee.org/document/9120956</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120956" target="_blank" >10.1109/ISSE49702.2020.9120956</a>

Result language
angličtina
Original language name
Interconnection of terminals on flexible substrates with printed conductive patterns
Original language description
This paper presents research focused on realisation and the testing of wire to Ag printed pad interconnections realised on flexible substrates. The research was concentrated mainly on the development of highly reliable resistance spot welded interconnection technology. The mechanically crimped contacts on the same test patterns were also realised for the comparison purposes. Realised interconnections were deeply tested in terms of 4-wire contact resistance measurement before, during and after climatic ageing. Two different flexible substrates and three wire finish metals (Cu, Sn, Ag) were used for the resistance spot welding process. The changes of test samples contact resistance during the dry heat test and damp heat test are described in the paper. It can be concluded that the resistance spot welding process can produce high reliable interconnections between wires and Ag printed terminals on flexible substrates. This technology is scalable to mass production, is low cost and properties of realised interconnections are comparable to conventional crimped interconnections.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020
ISBN
978-1-72816-773-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Web-based Conference, Demenovska, Slovakia
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500023

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