Influence of sweat on joints reliability between SMD chip resistors and conductive ribbons

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962562" target="_blank" >RIV/49777513:23220/21:43962562 - isvavai.cz</a>
Result on the web
<a href="https://pcns.events/wp-content/uploads/2021/09/3rdPCNSProceedings-eBook-compressed.pdf" target="_blank" >https://pcns.events/wp-content/uploads/2021/09/3rdPCNSProceedings-eBook-compressed.pdf</a>
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Influence of sweat on joints reliability between SMD chip resistors and conductive ribbons
Original language description
The article deals with the reliability testing of SMD chip resistors glued / soldered on conductive textile ribbons during ageing by artificial sweat. For the experiment, the flexible and stretchable textile ribbons with conductive track woven inside were used. The passive SMD chip resistors were conductively (low temperature soldering / UV gluing) connected onto the conductive tracks in ribbons. The prepared samples were submitted to the accelerated ageing by two types of artificial sweat (alkaline, acidic). The results show that reliability of soldered joints after ageing is better but both methods are usable for dedicated applications.
Czech name
—
Czech description
—

Project
<a href="/en/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Electrical Engineering Technologies with High-Level of Embedded Intelligence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Similar results(10)