Cold-curing potting compounds and possibilities of their modification by incorporation of nanoparticles

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962573" target="_blank" >RIV/49777513:23220/21:43962573 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Cold-curing potting compounds and possibilities of their modification by incorporation of nanoparticles
Original language description
Potting compounds are an integral part of many electrical or electronic devices where they can act as mechanical or light-sensitive protection. One subgroup of potting compounds is the so-called cold-curing resins. This article focuses on this type of epoxy-based potting compound. In addition to the study of their electrical properties and mechanical properties are also presented. The main attention is paid to the investigation of the incorporation of nanostructured particles of single metal oxides (Al2O3, SiO2, MgO) in different weight ratios and the study of their influence on the properties of the synthesized composites. Analyses of electrical properties include changes in relative permittivity, dielectric loss over a wide frequency range and volume resistivity estimated under DC conditions. In terms of mechanical analyses, the effect of selected particles on the ultimate tensile strength and elongation was studied. From the investigations carried out, it is clear that the selected base materials can
Czech name
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Czech description
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Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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