FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962821" target="_blank" >RIV/49777513:23220/21:43962821 - isvavai.cz</a>

Result on the web

<a href="https://www.mdpi.com/2073-4360/13/21/3702" target="_blank" >https://www.mdpi.com/2073-4360/13/21/3702</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/polym13213702" target="_blank" >10.3390/polym13213702</a>

Result language

angličtina

Original language name

FFF 3D printing in electronic applications: Dielectric and thermal properties of selected polymers

Original language description

The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength (Ep) and surface/volume resistivity (rs/rv) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant and loss factor were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.

Czech name

—

Czech description

—

Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/FW03010077" target="_blank" >FW03010077: InTechTex - Innovative Technology for Integration and Encapsulation of Electronic Components for Smart Protective Clothing Resistant to Harsh Environment</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Polymers

ISSN

2073-4360

e-ISSN

—

Volume of the periodical

13

Issue of the periodical within the volume

21

Country of publishing house

CH - SWITZERLAND

Number of pages

16

Pages from-to

1-16

UT code for WoS article

000726930600001

EID of the result in the Scopus database

2-s2.0-85118479478