Stretchability of Printed Conductive Structures for Thermoformable Structural Electronics
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972536" target="_blank" >RIV/49777513:23220/24:43972536 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10603907" target="_blank" >https://ieeexplore.ieee.org/document/10603907</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10603907" target="_blank" >10.1109/ISSE61612.2024.10603907</a>
Alternative languages
Result language
angličtina
Original language name
Stretchability of Printed Conductive Structures for Thermoformable Structural Electronics
Original language description
In this paper, the methodology for stretchability and thermoformability of printable conductive materials is developed. Thermoforming is the process of heating materials to their softening temperatures, followed by shaping over a mold. To examine and understand the stretching of foil during the thermoforming process, variable geometry of mold is proposed. The graphical grid is applied on a polycarbonate foil, and its deformation is evaluated. Based on these results, deformation of foil can be observed. After that, using the same method, the stretchability of various conductive printed electronics materials is observed its usability is evaluated.
Czech name
—
Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
979-8-3503-8547-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscaway
Event location
Prague, Czech Republic
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200048