Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973008" target="_blank" >RIV/49777513:23220/24:43973008 - isvavai.cz</a>

Result on the web

<a href="https://ieeexplore.ieee.org/document/10676067" target="_blank" >https://ieeexplore.ieee.org/document/10676067</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ICHVE61955.2024.10676067" target="_blank" >10.1109/ICHVE61955.2024.10676067</a>

Result language

angličtina

Original language name

Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

Original language description

This study is part of a comprehensive research project aimed at developing innovative composite materials by leveraging the advantageous properties of nanofillers. This paper focus on the dielectric properties of a new composite composed of polyesterimide resin with 1wt.% silicon dioxide (SiO2) nanoparticles, polyamide nonwoven nanofabric, and polyamide film. The dielectric properties are thoroughly evaluated using several key parameters: absorption/resorption currents and their derivative metrics, relative permittivity, dissipation factor across varied temperatures and frequencies, and dielectric strength. These metrics are crucial for assessing the composite’s performance under various electrical and temperature stresses, essential for high-voltage applications. The outcome is a novel four-component material with enhanced dielectric properties compared to traditional composites. Polyamide nonwoven nanofabric significantly improved dielectric strength without compromising other dielectric parameters. On the other hand, polyamide film served as the carrier material that enhanced mechanical properties, which are discussed in a separate paper. This material could potentially replace conventional insulating materials in specific applications, thanks to its enhanced performance and reliability. A significant advantage of used resin is its VOC-free nature and low viscosity, which facilitate easy impregnation and effective dispersion of nanoparticles.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

ISBN

979-8-3503-7498-8

ISSN

2381-5043

e-ISSN

2474-3852

Number of pages

4

Pages from-to

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Publisher name

IEEE

Place of publication

Piscataway

Event location

Berlin, Germany

Event date

Aug 18, 2024

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

001332851100035