Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973286" target="_blank" >RIV/49777513:23220/24:43973286 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10726365" target="_blank" >https://ieeexplore.ieee.org/document/10726365</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/PEMC61721.2024.10726365" target="_blank" >10.1109/PEMC61721.2024.10726365</a>

Result language
angličtina
Original language name
Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD
Original language description
This article discusses power losses, heating, and heat distribution on high-power PCBs fitted with high-power SMD components. The paper presents two thermal design methods for power SMD PCBs, compares them with each other, and contrasts them with reference thermal measurements on a PCB prototype. The main contribution of the paper is to evaluate simplified thermal estimation for rapid PCB prototyping and Computational Fluid Dynamics (CFD) thermal simulation for the final design and thermal optimization of the PCB in the PCB thermal design process. Therefore, the paper is divided into two parts. The first part discusses heat estimation using simplified analytical thermal calculations. The second part discusses thermal CFD modeling of PCBs and CFD thermal optimization. For verification purposes, two PCB variants are discussed—direct PCB cooling and double-sided cooling of the power SMD components. Two testing current values are used in the paper—20 A and 50 A.
Czech name
—
Czech description
—

Project
<a href="/en/project/TN02000054" target="_blank" >TN02000054: Božek Vehicle Engineering National Center of Competence</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC)
ISBN
979-8-3503-8523-6
ISSN
2469-8741
e-ISSN
2473-0165
Number of pages
6
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pilsen, Czech Republic
Event date
Sep 30, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001346863100044

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