Influence of dusty micro-particles contamination on adhesive bond strength

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60460709%3A41310%2F15%3A67698" target="_blank" >RIV/60460709:41310/15:67698 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Influence of dusty micro-particles contamination on adhesive bond strength
Original language description
A necessity for a bond creation is one of common attributes of production companies. An adhesive bonding technology is a method of a connecting. This method is suitable for workings with a single and serial production. Many research projects dealt with apreparation of adhesive bonds, degradation aspects etc. An area, which has not been properly investigated at present, is an influence of a contamination of the adhesive bonds by dusty micro-particles, e. g. from a ventilation of assembly shops, production hall etc. The research was focused on the evaluation of the influence of dusty micro-particles contamination of the two-component epoxy adhesive at the hardening process. The dusty micro-particles were gained from the filtering equipment used in a production hall. Sizes of gained dusty particles were analysed on sieves of dimensions 315 ?m, 250 ?m, 160 ?m, 90 ?m. Subsequently, these particles were added in various ratios into the mixture of the adhesive during its preparation. The adh
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JJ - Other materials
OECD FORD branch
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Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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